Process

Reflection Chemical Sputtering Physical Sputtering Radiation Enhanced Sublimation Penetration

Projectile H D T [3]He He Li Be B C N O Ne Mg Al Si P Ar Ti V Cr Fe Ni Cu Kr Nb Mo Xe Ta W Hg Bi mu D2 D3 H2 H2O H3 OH O2

Surface Chemical Component Be Graphite a-Carbon CFC Diamond C (unspecified) W WC Li B Al Si Ti V Cr Fe Ni Cu Ga Nb Mo Ta Au Al2O3 B(OH)3 BeO Be2C Be4B B2O3 B4C CB CD SiC SiO2 TaC Ta2O5 TiB2 TiC WO3 WO4 ZrC Be C W H D Li B O Al Si Ti V Cr Fe Ni Cu Ga Zr Nb Mo Ta Au

Data Description	Data Type
Mean Penetration Depth vs. angle and energy Sputtered energy and energy reflection coeff. vs. angle and energy Sputtering yields and particle reflection coeff. vs. angle and energy Sputtering yields vs. incident flux density Sputtering yields vs. surface temperature	Derived Experimental Theoretical

First Author	Publication	Date
Behrisch R. Doerner R.P. Eckstein W. Haasz A.A. Oyarrzabal E. Thomas E.W.	IAEA-APID-7A (1998) IAEA-APID-7B (2001) INDC(NDS)-249 (1991) INDC(NDS)-287 (1993) IPP 9/82 (1993) IPP 9/132 (2002) IPP 9/32 (1979) J. Appl. Phys. 93(9) (2003) J. Applied Physics 100(2006) J. Vac. Sci. Technol. A 23(6) (2005)	2012 2011 2009 2007 2006 2005 2003 2002 2002 2001 1998 1993 1991 1989 1987 1984 1983 1982 1981 1980 1979 1977 1976 1974 1971

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